高密度互连电路板薄型化技术探讨  

Thinning technology investigation of high density interconnecting printed circuit board

作　　者：黄勇 吴会兰 苏新虹 

机构地区：[1]珠海方正印刷电路板发展有限公司,广东珠海519173

出　　处：《印制电路信息》2013年第S1期300-303,共4页Printed Circuit Information

摘　　要：高密度互连电路板不断趋于薄型化。文章介绍了高密度互连电路板所用介质材料薄层化发展状态,并对薄型化加工中的关键技术问题进行了探讨。The high density interconnecting printed circuit board is becoming thinner and thinner. In this paper the thinning technology development status of dielectric material used in high density interconnecting printed circuit board was introduced, and the key technical issues in the thinning processing were discussed.

关 键 词：高密度互连 介质材料 薄型化技术 玻璃纤维布 阻抗 翘曲 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]