等离子对刚挠结合板分层问题的优化研究  

Optimization of delmination of R-FPC by using plasma treatment

作　　者：董颖韬[1] 何为[1] 陈苑明[1] 袁鹏飞[1] 范海霞[1] 黄勇 苏新虹 陈正清 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]珠海方正印刷电路板发展有限公司,广东珠海519713

出　　处：《印制电路信息》2013年第S1期322-326,共5页Printed Circuit Information

基　　金：广东省教育部产学研资助项目;项目编号2011A090200017

摘　　要：文章针对刚挠结合板制作过程中出现的分层问题,通过设计正交试验优化了等离子参数处理聚酰亚胺覆盖膜,分析了聚酰亚胺覆盖膜表面的粗糙度与接触角的相关关系,并通过拉力试验和热应力试验对比聚酰亚胺覆盖膜前后的层压效果。实验结果表明:聚酰亚胺覆盖膜的表面粗糙度Ra和表面接触角成一定的线性关系;等离子最优参数(气体比(CF4:O2)0.1,功率11 kW,时间10 min,流量1500 ml/min)处理聚酰亚胺覆盖膜,使层间结合力提高了0.88 N,且热应力测试没有出现分层现象。等离子处理聚酰亚胺覆盖膜可有效地解决了刚挠结合板层间分离的问题。Orthogonal experiment was designed to optimize the plasma treating parameters of polyimide cover iflm to prevent the delamination in rigid-lfex PCB manufacturing processes. The relationship between surface roughness and wetting angle of polyimide cover iflm was analyzed. The effects of hot press were also investigated through strain relief test and thermal stress test. The results showed that linear correlation was found in the relationship between surface roughness and wetting angle of polyimide cover film, polyimide cover film treated under the optimized plasma parameters [Gas ratio (CF4:O2) 0.1, Power 11kW, Time 10min, Flow 1500ml/min] had good agreement in binding force with the increase of 0.88N and delamination was avoided after thermal stress test. The approach of plasma treating to polyimide cover iflm could effectively solve the problem of Rigid-lfex delamination.

关 键 词：刚挠结合板 正交设计 等离子 分层 

分 类 号：TN41[电子电信—微电子学与固体电子学]