多孔纯钛板电镀铂层厚度的影响因素  

Factors Affecting the Platinum Layer Thickness of Platinum Plating Porous Titanium Plate

作　　者：许忠国[1] 汤慧萍[1] 

机构地区：[1]西北有色金属研究院金属多孔材料国家重点实验室,陕西西安710016

出　　处：《材料保护》2013年第S2期49-50,共2页Materials Protection

摘　　要：在多孔纯钛板表面电镀铂,研究了影响镀铂层厚度因素。结果表明:影响镀层性能的原因主要有阴阳极间距离、阴极电流密度(电流)、电镀时间等;由于多孔材料的孔隙发达,使镀液在孔隙中停留的时间较长,造成孔隙中的镀液浓度与本体溶液浓度差别较大,易使镀层不均匀,甚至在孔隙中镀不上;要精确控制镀层厚度的变化,目前尚存在困难。Electroplating Pt on porous pure Ti plate was carried out and the influences on the coating thickness were systematically studied. The results show that,the main influences on the properties of the coating are spacing of electrodes,density of cathode current and electroplating time used in the process. And also,it is found that an accurate control on the coating thickness is difficult at present. This is because that the concentration of electroplating solution is different between the pores and the surface of the porous Ti,which may make the coating uneven or no electroplating.

关 键 词：多孔钛板 电镀铂 镀层厚度 深镀能力 

分 类 号：TQ153.1[化学工程—电化学工业]