反应物浓度在SnAgCu纳米颗粒尺寸控制中的作用(英文)  

Role of reactant concentration in size control of SnAgCu nanoparticles

作　　者：张卫鹏[1,2] 赵炳戈[1,2] 邹长东[2] 翟启杰[2] 高玉来[1,2] 

机构地区：[1]上海大学微结构实验室,上海200436 [2]上海大学材料科学与工程学院,上海200072

出　　处：《中国有色金属学会会刊：英文版》2013年第6期1668-1673,共6页Transactions of Nonferrous Metals Society of China

基　　金：Projects(50971086,51171105)supported by the National Natural Science Foundation of China

摘　　要：在电子封装领域,通过利用纳米颗粒尺寸效应带来的熔点降低,SnAgCu合金体系有希望替代传统的但有毒的SnPb焊料体系。分别选用硼氢化钠和邻啡罗琳作为还原剂和表面活性剂,采用化学还原法制备出Sn3.0Ag0.5Cu(质量分数)合金纳米粒子。对合成的纳米颗粒形貌采用场发射扫描电镜(FE-SEM)进行表征。通过对扫描电镜数据的分析,可统计出纳米颗粒的尺寸分布。研究表明,所合成的纳米颗粒尺寸随着反应物浓度的增加而增大。通过理论分析,对反应物浓度在纳米颗粒尺寸控制中的作用进行了阐述。Attributing to the melting temperature depressing resulted from the size effect of nanoparticles, the SnAgCu alloy system can be a promising candidate to replace the traditional toxic SnPb solder in the field of electronic packaging. Chemical reduction method was used to fabricate the Sn3.0Ag0.5Cu (SAC) (mass fraction, %) alloy nanoparticles. Sodium borohydride and 1,10-phenanthroline were chosen as the reducing agent and surfactant respectively. In addition, the morphology of the synthesized nanoparticles was investigated by field emission scanning electron microscopy (FE-SEM), and the size distribution of the as-prepared particles was obtained from the image analysis. It was found that the particle size increased with increasing the reactant concentration. Finally, theoretical analysis was employed to illustrate the influence of reactant concentration on the particle size.

关 键 词：化学还原法 无铅焊料 SnAgCu合金 纳米颗粒 尺寸控制 反应物浓度 

分 类 号：TQ134.11[化学工程—无机化工]