硅微振梁式加速度计抗温漂的微结构及工艺设计  

Temperature insensitive design of MEMS resonant accelerometer

作　　者：王帆[1] 董景新[1] 赵淑明[1] 严斌[1] 

机构地区：[1]清华大学精密仪器系精密测试技术及仪器国家重点实验室,北京100084

出　　处：《中国惯性技术学报》2014年第2期227-232,共6页Journal of Chinese Inertial Technology

基　　金：国家十二五预研资助项目(51309020201)

摘　　要：针对硅微振梁式加速度计输出频率随环境温度漂移的问题,提出了抗温漂的硅微结构设计方法及相关工艺,降低了环境温度对输出的影响,在室温条件即可达到一定精度。通过建立"硅-玻璃"和"玻璃-陶瓷"耦合模型,分析了造成硅微振梁式加速度计温度漂移的原因。然后提出了"抗温漂耦合设计"的微结构和"半粘结封装"的封装工艺,降低了耦合模型中的理论温漂。利用加工出的原理样机进行实验,结果显示,采用抗温漂结构设计及封装工艺的原理样机,输出频率的温漂系数为-3.5×10-6/℃,室温下零偏稳定性为72.0μg。实验验证了抗温漂理论的可行性,可以满足室温下高精度硅微振梁式加速度计的设计要求。In view that MEMS resonant accelerometers have output frequency drifts which are varied with ambient temperature, a MEMS's structure design and processing technology are proposed to reduce the impact of ambient temperature and guarantees the high performance of MEMS resonant accelerometers at room temperature. Firstly, based on a 'silicon-glass' and 'glass-ceramic' coupling model, the main sources that cause the temperature effects are analyzed. Then, 'Silicon-Glass Coupling Method' and 'Half-Bonding Decoupling Method' are proposed to reduce the temperature effect in the coupling models. Finally, a principle prototype based on the theory is used to implement experiments, and the experiment results show that the temperature coefficient of natural frequency is -3.5×10-6/°C, and the bias stability is 72.0 (g at room temperature. The experiments verify that the proposed temperature-insensitive design is feasible and satisfies the requirements of high-performance MEMS resonant accelerometers at room temperature.

关 键 词：硅微振梁式加速度计 温度漂移 抗温漂耦合设计 半粘结封装 

分 类 号：U666.1[交通运输工程—船舶及航道工程]