钎焊时间对Sn-3.0Ag-0.5Cu/Cu钎焊接头界面化合物的影响  

Effect of soldering time on intermetallic compounds of Sn-3. 0Ag-0. 5Cu and Cu welding joint

作　　者：许媛媛[1] 闫焉服[1] 王新阳[2] 王红娜[1] 马士涛[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南科技大学车辆与交通工程学院,河南洛阳471023

出　　处：《材料热处理学报》2015年第3期67-71,共5页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(51175151)

摘　　要：研究了不同钎焊时间下Sn-3.0Ag-0.5Cu/Cu焊点界面金属间化合物生长变化规律和剪切强度变化。结果表明:随着钎焊时间增加,界面化合物平均厚度逐渐增加,且生长的时间指数为0.4。钎焊60s内界面化合物的生长速率较大;随着钎焊时间的增加,钎焊接头的抗剪切强度先增加后降低,这与界面处脆硬相Cu6Sn5生长行为密切相关。The growth and shear strength of intermetallic compounds( IMC) at the interface between Sn-3. 0Ag-0. 5Cu lead-free solder and Cu substrate during different soldering time were studied. The results show that with the increase of soldering time,the average thickness of the IMCs increases gradually and the growth index is 0. 4. The growth rate is larger when the soldering time is within 60 s. With the increase of the soldering time,the shear strength of welding joint increases firstly,then decreases gradually. This is closely related to the growth behavior of the hard brittle phase Cu6Sn5.

关 键 词：界面化合物 钎焊时间 厚度 抗剪切强度 

分 类 号：TG454[金属学及工艺—焊接]