TSV转接板组装工艺对微凸点可靠性的影响  

EFFECTS OF TSV INTERPOSER ASSEMBLY PROCESS ON RELIABILITY OF MICROBUMPS

作　　者：陈思[1] 秦飞[1] 夏国峰[1] 

机构地区：[1]北京工业大学机械工程与应用电子技术学院,北京100124

出　　处：《工程力学》2015年第6期251-256,共6页Engineering Mechanics

基　　金：国家自然科学基金项目(11272018)

摘　　要：TSV转接板组装工艺过程引起的封装结构翘曲和应力对微凸点可靠性有重要影响。该文采用有限元方法,分析了TSV转接板封装自上至下和自下至上两种组装工艺流程,通过比较工艺应力/应变和翘曲得到较优工艺流程;针对优选工艺流程,分析了不同工艺步微凸点的力学行为,重点关注封装结构中微凸点定位对微凸点可靠性的影响。结果表明:自上至下组装工艺流程较优;微凸点位置设计应尽量避开下填料边缘,当微凸点正好位于TSV上方时,微凸点阵列塑性功密度最低,且分布均匀,微凸点的这种定位设计最为合理。Warpage and stress arising from the assembly process of a TSV interposer have important impacts on the reliability of microbumps. In this paper, two assembly processes, the top-down process and the bottom-up process, are simulated by the finite element method. By comparing the warpage and stress induced in the two assembly processes, an optimized process is obtained. The mechanical behavior of microbumps during each step of the optimized process is investigated by focusing on the effect of microbump location on the microbump reliability. The results show that the TSV-copper deformation has significant impact on the plastic work density of the microbump, the microbumps should be designed to keep away from the underfill fillet. In the case of the microbump located right up on the TSV, the plastic work density of the microbump array is the lowest and has an almost uniform distribution.

关 键 词：TSV转接板 数值模拟 工艺流程 微凸点 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]