碱性焦磷酸盐镀液电镀Sn-Ag无Pb钎料的研究  

ELECTRO-DEPOSITION OF Sn-Ag LEAD-FREE SOLDER BY ALKALINE PYROPHOSPHATE BATH

作　　者：乔木[1] 冼爱平[1] 尚建库[1] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室,沈阳110016

出　　处：《金属学报》2004年第8期822-826,共5页Acta Metallurgica Sinica

基　　金：国家自然科学基金项目 50228101;国家863计划项目2002AA322040资助

摘　　要：电子封装无Pb化进程中,对无Pb钎料可焊性镀层技术的发展和应用提出了要求.本文给出一种碱性焦磷酸盐镀液及其电沉积工艺,以获得Sn-Ag无Pb焊料的可焊性镀层.研究了镀液中的主盐浓度、电流密度、镀液温度及搅拌等工艺条件对镀层中Ag含量及镀层表面形貌的影响.In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.

关 键 词：无Pb焊料 电镀 Sn-Ag合金 电子封装 

分 类 号：TQ153[化学工程—电化学工业]