微桥结构Ni膜杨氏模量和残余应力研究  

Measurement of Young's Modulus and Residual Stress of Nickel Film Microbridges by MEMS Technology

作　　者：周勇[1] 王明军[1] 杨春生[1] 陈吉安[1] 王莉[1] 丁桂甫[1] 张亚民[1] 高孝裕[1] 张泰华[2] 

机构地区：[1]上海交通大学微纳米科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200030 [2]中国科学院力学研究所非线性力学国家重点实验室,北京100080

出　　处：《现代科学仪器》2004年第4期24-27,共4页Modern Scientific Instruments

基　　金：国家重点基础研究发展规划(973)项目-"集成微光机电系统研究"子项目(G1999033103)资助。

摘　　要：采用MEMS(MicroelectromechanicalSystems)技术研制了镍(Ni)膜微桥结构试样,应用陶瓷压条为承力单元,与纳米压痕仪XP系统的Berkovich三棱锥压头相结合,解决了较宽Ni膜微桥加载问题。测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了Ni膜微桥的杨氏模量及残余应力,其值分别为190.5GPa和146MPa,与应用纳米压痕仪直接测得的带有Si基底的Ni膜杨氏模量186.8±7.34GPa相吻合。The Microbridge testing method is used to measure the Youngs modulus and residual stresses of metallic films.Samples of nickel film microbridges are fabricated by the MEMS (Microelectromechanical Systems)technology. Specialceramic shaft structure is designed to solve the problem of getting the load-deflection curves of Ni microbridge by NanoindenterXP system with normal Berkovich probe. Theoretical analysis of the microbridge load-deflection curve is proposed to evaluatethe Youngs modulus and residual stress of the films simultaneously. The calculated results based on experimental measure-ments show that the average Youngs modulus and residual stress for the electroplated nickel films are: 190.5 GPa and 146MPa, respectively, while the Youngs modulus measured by nano-hardness method on the same nickel film based on siliconsubstrate is 186.8 7.34 GPa.

关 键 词：Ni膜微桥 MEMS技术 力学性能 

分 类 号：TN402[电子电信—微电子学与固体电子学]