高性能树脂基覆铜板的研究进展  

ADVANCE IN THE RESEARCH OF HIGH PERFORMANCE COPPER CLAD LAMINATE BASED ON RESIN MATRIX

作　　者：周文胜[1] 梁国正[1] 房红强[1] 任鹏刚[1] 杨洁颖[1] 

机构地区：[1]西北工业大学理学院应用化学系,西安710072

出　　处：《工程塑料应用》2004年第7期71-74,共4页Engineering Plastics Application

摘　　要：对高性能新型环氧树脂、双马来酰亚胺、氰酸酯等热固性树脂及聚苯醚、聚四氟乙烯、聚酰亚胺等热塑性树脂基覆铜板的近况及发展进行了综述。对用于覆铜板的新型环氧树脂体系、环氧固化体系、环氧改性剂的应用进行了重点阐述 ,并指出发展覆铜板的关键是加强高性能树脂基体的研究 ,即研制具有高耐热性、优异介电性能、阻燃环保性、能阻挡紫外光和具有自动光学检测功能等特性的树脂是今后的发展方向。The development and recent situation of high performance copper clad laminate based on novel epoxy, bismaleimide, cyanate ester, etc. thermosetting resins and polyphenyl ether, polytetrafluoroethylene polyimide, etc. thermoplastic resins are summarized. The application of novel epoxy system, curing system and its modified agent are mainly discussed. The key of development of copper clad laminates is to strength the research of novel resin which has high performance such as high thermal resistance, excellent dielectric properties, flame retardance and environment protection, anti UV and AOI function.

关 键 词：树脂基覆铜板 环氧树脂 印制线路板 环氧固化体系 环氧改性剂 

分 类 号：TN41[电子电信—微电子学与固体电子学]