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机构地区:[1]西南科技大学信息与控制工程学院,四川绵阳621010
出 处:《仪表技术与传感器》2004年第9期43-45,共3页Instrument Technique and Sensor
基 金:国家863项目"半导体激光器泵浦源蚀刻屋脊式微通道"(2 0 0 3AA40 41 6 0 );国防基础研究项目"MEMS(微电子机械系统 )微通道冷却器研究"(K1 3 0 3 0 6 0 1 1 5);教育部重点项目 (2 0 41 1 9);西南科技大学引进人才科研启动基金 (ZK0 43 1 0 0 )
摘 要:针对高功率电子器件散热问题,介绍了国际前沿领域电子设备热控制的技术动态。讨论了基于MEMS技术的微冷却器有体积小,散热面积大,消耗功率低,批量制作经济性好等优点。分析了微通道、微喷流和微热管3种基于MEMS技术的新型微冷却方式的传热原理、目前的技术状况及应用前景。微通道的采用增加了对流换热面积,提高了对流换热系数;微喷流冷却器中由于高速冷却液的形成,显著提高了换热系数;微热管均热效果极佳。Development and application of frontier heat control in electronic apparatus was presented,which aimed at the cooling problem of high power electronic devices.Small volume,great cooling performance,low power consumption,and good cost-effectiveness under mass manufacturing were proposed as merits of the novel microcooling methods based on the MEMS technology,including microchannel heatsink,micro jet impingement cooling and micro heat pipe.Principles of the heat transfer,state of the arts and perspective applications of above three microcooling methods were discussed.The adoption of microchannels incresed heat dissipation area and thus enhances convective heat transfer coefficient.The heat transfer coefficient of micro jet impingement cooling is evidently improved because of high-speed coolant.Micro heat pipe cooling has the advantage of excellent thermal uniformity.
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