固化工艺对HT1012铜粉导电胶剪切强度的影响  

Effect of curing conditions of HT1012 copper powder electrically conductive adhesive on shear strength of single-lap joint

作　　者：毛玉平[1] 游敏[1] 邓冰葱 郑小玲[1] 余海洲[1] 

机构地区：[1]三峡大学机械与材料学院,湖北宜昌443002 [2]湖北回天胶业股份有限公司,湖北襄樊441003

出　　处：《粘接》2004年第4期11-13,共3页Adhesion

基　　金：湖北省教育厅重大科研项目 ( 2 0 0 3Z0 0 1)

摘　　要：研究了固化工艺参数对由HT10 12型铜粉导电胶制备的单搭接接头剪切强度的影响。结果表明 ,在所采取的研究条件下 ,随着晾置时间的推移 ,导电胶剪切强度起初增加但随后减小 ;当固化温度为 6 0℃、晾置时间取定为 10min时 ,固化时间为 3h所对应的剪切强度较高 ;当变动固化温度时 ,固化温度提高会引起剪切强度下降。s: The effect of curing condition of HT1012 conductive adhesive on the shear strength of single-lap joint was investigated. The results showed that the shear strength of the single-lap joint increased first and then decreased as the open assembly time lengthened. The shear strength was relatively higher when the open assembly time was 10 min and the curing time at 60 ℃ was 3 h. And the lower shear strength was obtained while the curing temperature was higher.

关 键 词：固化工艺 铜粉导电胶 剪切强度 单搭接接头 

分 类 号：TQ436.9[化学工程]