超薄精密传感器的电子束封装焊接  

SEALLING WITH EBW FOR ULTRATHIN ACCURATE SENCER

作　　者：林世昌[1] 范炳林[1] 胡宗耀 王秀梅 张燕生[1] 

机构地区：[1]中国科学院电子学研究所

出　　处：《焊接》1993年第3期17-19,共3页Welding & Joining

摘　　要：通过高精度压力传感器、薄膜温敏传感器和管式应变计传感器的电子束封装焊接实践,讨论了电子束焊在超薄精密传感器封装焊接中需要注意的工艺因素。Experimental sealling with EBW are carried out for high accurate pressure transducer, thin-film temperature sencer and tube shape strain transducer etc. The good results are presented in using EBW process for sealling the ultrathin accurate sencers and transducers.

关 键 词：真空电子束焊 封装 传感器 

分 类 号：TG456.3[金属学及工艺—焊接]