铜线材氟硼酸盐高速电镀光亮锡铅及锡铅钴合金  

High Speed Eeectroplating Bright Sn-Pb& Sn-Pb-Co Alloy Bath on Copper Wire in Fluoroborate Plating Bath

作　　者：罗序燕[1] 李东林[1] 

机构地区：[1]江西理工大学材料与化工学院,江西赣州341000

出　　处：《表面技术》2004年第4期67-68,共2页Surface Technology

摘　　要：　用DL01、DL03作光亮剂,在氟硼酸盐镀液中,改变电流密度和搅拌速度在0.5mm的铜线上,电镀出锡 铅和锡 铅 钴合金镀层。结果表明,在Jc=5～18A dm2,v=47、96、150m min时,Sn与Pb的共沉积属异常共沉积。当Jc>30A/dm2时属正常共析。当镀液中含有Co时促进了Sn的共沉积。Using DL01,03 as brightener, bright Sn-Pb & Sn-Pb-Co alloy coatings on Ф0.5mm copper wire were electroplated in fluoroborate plating baths under different current density Jc(A·dm^(-2)) and agitation speed V(m·min^(-1)) in fluoroborate plating baths. The results indicated that the Sn-Pb co-deposit under Jc(A·dm^(-2))=5～18, V(m·min^(-1))=47, 96 & 150 is abnormal co-deposit. Under Jc(A·dm^(-2))>30, Sn-Pb co-deposit is normal co-deposit. When the bath contained 3.86g·L^(-1) Co(BF_4)_2, Co^(2+)accelerated Sn^(2+) deposit.

关 键 词：高速电镀 锡-铅 锡-铅-钴 合金 

分 类 号：TQ153.2[化学工程—电化学工业]