Sn-Ag基无铅焊料应变率效应的研究  

Research of the Strain-rate Effect of Pb-free Sn-Ag Base Solders

作　　者：支建庄[1] 黄健群[1] 范伏生[1] 姚战军[1] 

机构地区：[1]军械工程学院,河北石家庄050003

出　　处：《电子元件与材料》2004年第11期30-33,共4页Electronic Components And Materials

摘　　要：随着人们环保意识的增强,在世界范围内开展了对无铅焊料的研究和开发。利用分离式Hopkinson压杆实验技术研究了Sn-Ag系无铅焊料在不同应变率下的动态压缩性能。实验表明Sn-Ag系无铅焊料有的明显应变率效应:与静载荷作用下的情况相比,冲击载荷作用下的屈服和流动应力有显著的提高;与锡铅焊料相比,其动态力学性能有明显的优势。The research and development of the lead-free solder of high performance has been pushed forward by the highly developed environmental conservation. Dynamic compression tests of Pb-free Sn-Ag base solder are made on the Split Hopkinson pressure bar at various strain rates. The dynamic mechanical prosperities and the effect of strain-rate of lead-free solder discussed explain that Sn-Ag solder is attractive to the electronic industry.

关 键 词：金属材料 无铅焊料 分离式霍普金森压杆 应变率效应 

分 类 号：TN604[电子电信—电路与系统]