溅射非晶态薄膜磁性的控制  

Magnetic Property Control of Sputtering Amorphous Film

作　　者：柳丽娜[1] 高诚辉[1] 李有希[1] 李友遐[1] 

机构地区：[1]福州大学机械工程及自动化学院,福建福州350002

出　　处：《材料保护》2004年第11期35-37,共3页Materials Protection

摘　　要：　微电子技术的迅速发展要求电子元件薄膜化,从而促进了磁性薄膜的发展。为了达到控制溅射非晶态薄膜磁性的目的,从溅射非晶态薄膜的组成成分、溅射工艺参数、基体材料及温度、膜层厚度和镀后热处理工艺等几方面论述了影响非晶态溅射薄膜磁性的因素,结果表明,薄膜组成、膜厚、基材、溅射工艺及镀后热处理对溅射非晶态薄膜的磁性有较大的影响,应根据不同磁性要求加以控制。Rapid development of micro-electronic technology requires electronic equipment thinner and thinner, which promotes the development of magnetic films. The effect of film composition, sputtering process parameters, substrate material and its temperature, film thickness and specification of heat treatment were discussed to realize the magnetic property control of sputtering amorphous films.

关 键 词：非晶态薄膜 溅射 磁性 

分 类 号：TG174.444[金属学及工艺—金属表面处理]