铜基记忆合金晶粒细化研究现状和发展趋势  

Research and Development Trends on Grain-Refinement of Cu-Based SMAs

作　　者：巴宏波[1] 陈庆福[1] 

机构地区：[1]辽宁工学院材料与化学工程学院,辽宁锦州121001

出　　处：《辽宁工学院学报》2004年第5期52-55,共4页Journal of Liaoning Institute of Technology(Natural Science Edition)

基　　金：辽宁省自然科学基金项目(编号:2000101055)

摘　　要：铜基形状记忆合金具有价格低廉、热稳定性好和高温应用前景等优点,然而晶间断裂和晶粒粗大是其目前未得到实用化的技术关键。本文概述了铜合金产生晶间断裂及晶粒粗大的原因,总结了目前该合金的晶粒细化方法及其优缺点,并指出了直流脉冲电场处理是有发展潜力的方法,同时探索了该合金的应用前景。Cu-based shape memory alloys possess low price, good thermal stability and the property of high temperature application. But intergranular crack and grain coarseness are its technology issues retarding practical application. The reasons for intergranular crack and grain coarseness are summarized,the measures of grain-refinement and their merits and faults concluded. It points out the discussed electron pulse modification possesses better development potential, with the application prospects in Cu-based alloys approached and explored.

关 键 词：晶粒细化 晶间断裂 铜基形状记忆合金 铜合金 脉冲电场 实用化 热稳定性 研究现状 处理 原因 

分 类 号：TG146[一般工业技术—材料科学与工程] TG139.6[金属学及工艺—金属材料]