退火气氛及扩散阻挡层对多层膜热稳定性的影响  

Effect of Annealing Ambient and Diffusion Barrier on Thermal Stability of Multilayer

作　　者：杨振良[1] 宋忠孝[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2004年第11期1195-1198,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金重点项目(59931010)

摘　　要：沉积在 ZrN,TaN 阻挡层上的 Cu 膜分别在真空和氢气、氮气的混合气氛下退火。利用 SEM、XRD 和电阻率来表征多层膜的热稳定性。实验结果表明:对于沉积在同种阻挡层上的多层膜在混合气氛中退火的热稳定性较真空退火的要高。对真空退火处理,沉积在 ZrN 阻挡层上的多层膜的热稳定性比沉积在 TaN 阻挡层上的要高。研究结果表明:多层膜的热稳定性的评价不仅跟多层膜本身的因素有关,如阻挡层的种类,还和退火气氛有关。Cu film deposited on ZrN and TaN diffusion barriers is annealed in vacuum and H-2, N-2 mixed gas respectively. SEM morphology, XRD and resistivity are employed to characterize the thermal stability of the multilayer. The experiment demonstrates that for the muitilayer deposited on the same kind of diffusion barrier, the thermal stability of multilayer annealed in H-2, N-2 mixed gas is superior to that annealed in vacuum. While for the multilayer annealed in vacuum, the thermal stability of the multilayer deposited on ZrN diffusion barrier is better than that deposited on TaN diffusion barrier. The investigation shows that the evaluation of the thermal stability of the multilayer should take not only some intrinsic factors of the multilayer itself, for instance diffusion barriers, but also the annealing ambient into account.

关 键 词：沉积Cu膜 热稳定性 扩散阻挡 退火气氛 

分 类 号：TG156.2[金属学及工艺—热处理]