Flip-chip芯片关键技术的研究  

Research on Flip-chip Key Technologies

作　　者：芮延年[1] 刘开强[1] 张志伟[1] 陈慧萍[1] 

机构地区：[1]苏州大学机电工程学院,江苏苏州215021

出　　处：《苏州大学学报（工科版）》2004年第5期19-22,共4页Journal of Soochow University Engineering Science Edition (Bimonthly)

摘　　要：Flip chip是一种微电子制造表面贴装新工艺,应用于生产还有一些问题未能得到很好的解决。本文通过对组装工艺过程中热应力、封装工艺等关键技术问题的研究,建立了热应力、焊接过程力学模型,为Flip chip的生产进行了一些富有意义的探索。Flip-chip is a new kind of microelectronic surface mounting technics, but some problems of its application in production are not better solved yet. Through research on the key technologies as thermal stress and mounting technics in assembling process, this paper constructed mechanical model of thermal stress and welding process, made some significative exploration for the better production of Flip-chip.

关 键 词：Flip-chip芯片 微电子 表面贴装 组装工艺 热应力 封装工艺 

分 类 号：TN405[电子电信—微电子学与固体电子学]