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出 处:《粘接》2004年第6期1-3,共3页Adhesion
摘 要:研究了环氧树脂导电胶固化过程中电阻的变化与电板之间距离的关系,根据实验结果提出了如下观点:导电胶在固化过程中由不导电变为导电,是由于导电填料颗粒凝聚成为导电团簇并进一步形成导电网络。固化时体积收缩固然对电阻降低有一定贡献,但是和导电团簇形成相比它的重要性是第二位的。银粉颗粒凝聚形成导电网络与吸附在表面上的分散剂有密切的关系。Formation of conductive network upon curing of isotropically conductive adhesives was studied with a silver-epoxy system. It was found that the change of resistance vs. time for isothermal curing was dependent on the gap between the electrodes. Based on this dependence, it was proposed that clusters of conductive particles are formed and grow up upon the curing, which then form a network of interconnected conductive chains. Shrinkage of resin curing does make a primary contribution to the reduction of resistance ; however, this contribution is of secondary importance in comparing with that of the cluster formation. The cluster formation was greatly influenced by the dispersant adsorbed on the surface of conductive particles.
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