无铅锡基钎料合金设计和合金相图及其计算  

Design of lead-free solder alloy and alloy phase diagram calculation

作　　者：乔芝郁[1] 谢允安[1] 曹战民[1] 袁文霞[1] 孙勇[2] 祁更新[2] 

机构地区：[1]北京科技大学物理化学系,北京100083 [2]昆明理工大学材料冶金工程学院,昆明650093

出　　处：《中国有色金属学报》2004年第11期1789-1798,共10页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(50071009);云南省科技攻关计划资助项目(2002GG07)

摘　　要：阐述了无铅钎料合金设计的原则,讨论了合金相图及其计算在无铅锡基钎料合金设计中的作用。利用相图计算技术筛选了可能代替Pb Sn共晶钎料合金的Sn Zn In三元(x(Zn)<0.11,x(In)=0.10～0.14)和Sn Zn In Ag四元(x(Sn)=0.800,x(In)=0.090,x(Zn)=0.075,x(Ag)<0.049)无铅锡基钎料合金。初步讨论了用相图计算技术在富Sn四元Sn Zn In Ag无铅钎料合金基础上,添加Bi,Sb等低熔点金属和微量Ce,La等稀土元素以降低贵金属In和Ag的含量,进一步提高无铅锡基多元合金钎料的综合性能和性能价格比。The principles for lead-fsee solder alloy design and the importance of phase diagram study as well as the calculation of phase diagram(CALPHAD) approach in the lead-free solder alloy design are discussed. Based on CALPHAD approach two potential lead-free solder alloys, i.e., the Sn-Zn-In(x(Zn)<0.11, x(In)=0.100.14)ternary alloy and the Sn-Zn-In-Ag(x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)<0.035)quaternary alloy are recommended as lead-free solder alloy instead of the Pb-Sn eutectic solder alloy. The further work for decreasing the content of In and Ag in Sn based Pb-free multi-component alloy with excerlent properties is brief discussed.

关 键 词：钎料合金 无铅钎料 相图 相图计算 

分 类 号：TG113.14[金属学及工艺—物理冶金]