化学镀Ni-Cu-P镀液组成研究  

Study on the Composition of Electroless Ni-Cu-P Plating Solution

作　　者：刘波[1] 黄燕滨[1] 张平[1] 刘德刚[1] 许晓丽[1] 孟昭福[1] 

机构地区：[1]装甲兵工程学院材料科学与工程系,北京100072

出　　处：《中国表面工程》2004年第6期36-39,共4页China Surface Engineering

摘　　要：应用正交设计方法,研究Ni–Cu–P化学镀液主要成分对化学沉积Ni–Cu–P合金镀层性能的影响。对Ni–Cu–P镀液体系进行了优化,获得了外观平滑、光亮和耐蚀性能好的Ni–Cu–P三元合金镀层。复合络合剂的加入有效抑制了铜的优先析出,获得了具有优异结合力的镀层。经X射线衍射分析可知,当镀液中硫酸铜的量小于0.5g/L时所得镀层为非晶态结构。In this paper, an orthogonal experiment method was applied to study the influence of solution composition on the quality of coating. The parameters of technology were optimized and a good corrosion-resistant Ni–Cu–P coating was obtained with smooth and shining appearance. The composite complex-agents can prevent the preferential separation of copper from solution and obtain coatings with strong adhesion. Through XRD analysis it can be oncluded that the coating structure is amorphous when the quantity of CuSO4·5H2O in the bath is less than 0.5 g/L。

关 键 词：化学镀 NI-CU-P 耐蚀性 结合力 

分 类 号：TQ153.2[化学工程—电化学工业]