光发射模块中激光器与光纤的无源耦合  

Passive-alignment of Laser Diode-fiber for Optical Transmitter

作　　者：杨存永[1] 汪锁发[1] 赵知夷[1] 

机构地区：[1]中科院微电子研究所,北京100029

出　　处：《半导体技术》2005年第1期66-68,共3页Semiconductor Technology

摘　　要：对光电发射模块中激光器与光纤的无源耦合作了研究。利用成熟的100mm硅工艺研制成功了无源耦合用硅基平台,并可以批量生产。在此基础上利用倒装工艺实现了激光器与单模光纤的无源耦合, 出纤光功率达到了毫瓦级,且经过37次高低温冲击性能不变。The design and fabrication of the silicon optical bench for passive-aligned packaging of optical transmitter are presented, and the silicon optical bench can be massy produced. Passive alignment is accomplished by using flip-chip bonding technology. In the result, the optical output of the module is greater than 1mW and the performance of the module keeps fine after 37 times temperature cycles.

关 键 词：硅基平台 无源耦合 V型槽 

分 类 号：TN751.1[电子电信—电路与系统] TN248