含氯硅烷/聚硅氧烷改性环氧树脂  

Epoxy Resin Modified by Chloric Silane/Polysiloxane

作　　者：黎艳[1] 刘伟区[1] 宣宜宁[1] 

机构地区：[1]中国科学院广州化学研究所,广州510650

出　　处：《应用化学》2005年第2期176-179,共4页Chinese Journal of Applied Chemistry

摘　　要：用一氯三甲基硅烷(TMS)、二氯二甲基硅烷(DMS)或DMS与α,ω- 二氯聚二甲基硅氧烷(DPS)的混 合物改性双酚A型环氧树脂(EP),制备可用于电子封装的高性能环氧基料。通过对固化物的冲击强度、拉伸 强度、断裂伸长率和玻璃化转变温度(Tg)的测定,探讨了改性方法、有机硅组成与含量等对材料性能的影响。 结果表明,当m(DMS)∶m(EP)=5.7∶100时,树脂固化物的冲击强度达到20.2kJ/m2,拉伸强度达67.04MPa, 断裂伸长率达11.29%,Tg达167.98℃;分别比未改性时提高了9.4kJ/m2、21.1MPa、5.35%和32.56℃。而 当m(DMS)∶m(DPS)∶m(EP)=0.7∶10∶100时,除Tg和拉伸强度略有上升外,冲击强度达到31.6kJ/m2,断裂 伸长率达81.68%,分别比纯环氧提高了20.8kJ/m2和75.64%。Bisphenol A epoxy resin was modified by trimethylchlorosilane(TMS), dimethyldichlorosilane(DMS), or the mixture of DMS and α,ω-dichloro-polydimethylsiloxane(DPS). The influences of modification method and the composition and content of organic silicon on the properties of the material were investigated via the measurements of impact strength, tensile strength, elongation and glass transition tempereture(T g). The results show that the impact strength of epoxy resin modified with 5.7 g of DMS is 20.2 kJ/m 2, tensile strength 67.04 MPa, elongation 11.29% and T g 167.98 ℃, more than that of pure epoxy resin by 9.4 kJ/m 2, 21.1 MPa, 5.35% and 32.56 ℃, respectively. The epoxy resin modified with a mixture of 0.7 g of DMS and 10 g of DPS has the impact strength of 31.6 kJ/m 2 and elongation of 81.68%, respectively, higher than that of pure resin by 20.8 kJ/m 2 and 75.64%, while its T g and tensile strength seems to have little improvement.

关 键 词：环氧树脂 α ω-二氯聚二甲基硅氧烷 一氯三甲基硅烷 二氯二甲基硅烷 电子封装 

分 类 号：O631.2[理学—高分子化学] TQ323.5[理学—化学]