国外MCM及其主要制造技术的发展现状  

Current Development of Multi-Chip-Modules and Its Manufacturing Technologies Abroad

作　　者：毅力 

机构地区：[1]航空航天部六九一厂,陕西西安710054

出　　处：《微电子学》1993年第5期1-10,共10页Microelectronics

摘　　要：MCM具有胜过PCB、LSI和一般HIC的诸多优点,正在逢勃发展,可望成为九十年代的代表性技术。本文从市场和技术两个方面评述MCM的发展潜力,重点介绍近年来国外MCM主要制造技术的现状及发展态势,试图引起人们对它的关注。Multi-chip-modules,which have many advantages over PCB' s.LSI' s and common HIC' s.are vigorously developing and are expected to become one of the mainstream technologies in the 90' s. Potentials in the development of multi-chip-modules (MCMs)are reviewed in terms of the market and technologies. The emphasis is placed on the introduction of the current state of the main technologies for MCM' s abroad and their developing trends.

关 键 词：多芯片组件 功能模块 微型组件 

分 类 号：TN42[电子电信—微电子学与固体电子学]