基于E型圆膜片的复合差动谐振式敏感元件  

The Thermally Excited Resonant Silicon Micro Structural Pressure Sensor

作　　者：樊尚春[1] 乔少杰[1] 

机构地区：[1]北京航空航天大学仪器学院 测控与信息技术系,北京100083

出　　处：《科学技术与工程》2005年第5期313-315,共3页Science Technology and Engineering

基　　金：国家自然科学基金(50275009)航空科学基金(02I51018)资助

摘　　要：对以E型圆膜片为一次敏感元件、一对对称的硅梁谐振子为二次敏感元件的复合差动敏感元件的力学特性进行了分析。给出了其敏感压力、差压、集中力与加速度时,梁谐振子固有频率随被测量变化的解析计算模型。Based on a novel resonant sensitive micro structure, whose preliminary sensing component is an E-type round diaphragm and the final sensing component is a pair of beam resonators which are located at the inner and outer edges of the E-type round diaphragm, respectively. The unique advantage of this sensing structure is that the differential measuring mechanism can be realized and some measurands, such as absolute pressure, differential pressure, concentrated force and the acceleration. The relationship between the natural frequencies of the beam resonators and the measurands are presented.

关 键 词：E型圆膜片 硅微传感器 谐振式传感器 差动检测 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]