射频溅射薄膜改善氮化铝陶瓷与金属连接性研究  

Joining AIN Ceramic to Metals with R.F. Sputtering Film

作　　者：朱胜[1] 霍辛斯基 徐滨士[2] 

机构地区：[1]波兰华沙理工大学 [2]中国机械工程学会表面工程研究所

出　　处：《中国表面工程》1998年第4期5-9,共5页China Surface Engineering

基　　金：波兰"高科技"基金

摘　　要：本文介绍了一种改善氮化铝（AlN）陶瓷与金属连接性的新工艺方法。首先采用射频溅射在AlN陶瓷表面沉积铝、钛薄膜，然后用真空钎焊和扩散焊实现经表面改性的AlN陶瓷与Cu和FeNi42等金属的连接。由于射频溅射于射频溅射的Al、Ti薄膜改善了AlN陶瓷与金属的润湿性，所以AlN／金属的结合强度明显提高。通过对结合界面的显微形貌结构分析以及接头应力计算，阐明了采用功能梯度材料（FGM）过渡层可以进一步改善AlN／金属的连接性。A method was developed to improve the joining of aluminum nitride (AlN) ceramic and metals.The surface of AlN ceramic was first sputtered by radio frequency (R.F.) with aluminum or titanium film. And then brazing with AgCu19.5Ti3In5 filler as well as diffusion bonding processes were investigated to join the different surface modified AlN ceramics to Cu and FeNi42 metals. The strength of the joints was improved because the interfacial sputtering film improved the wettability of AlN. Based on the results of the microstructure and chemical interactions studies and residual stresses calculations, it is believed that the joining ability of AlN ceramic to metals can be improved further with a functionally gradient material (FGM) interlayer.

关 键 词：金属 扩散焊 真空钎焊 表面沉积 过渡层 射频溅射 结合强度 AIN陶瓷 氮化铝陶瓷 新工艺 

分 类 号：TG174[金属学及工艺—金属表面处理] TQ174[金属学及工艺—金属学]