厚膜多层混合电路的计算机辅助设计  

The CAD of Multilayer Thick-Film Hybrid Circuit

作　　者：魏建蓉[1] 姜伟卓[1] 俞正平[1] 

机构地区：[1]电子工业部第14研究所

出　　处：《电子元件与材料》1994年第2期37-40,共4页Electronic Components And Materials

摘　　要：结合厚膜多层混合电路的特点，针对ＥＥｓｙｓｔｅｍ存在的缺少ＳＭＴ元件库、自动布线网格太大、无埋孔等缺点对其做了改进，使之适合于厚膜多层混合电路设计。In accordance with features of multilayer thick-film hybrid circuit there is a improvement which has overcome some disadvantages of the hybrid including lack of SMT components stock in EE system,too big network checks for autowiring, regardless of countersunks and the others. The improvement fits the multilayer hybrid to it's design

关 键 词：厚膜混合电路 CAD 

分 类 号：TN452.02[电子电信—微电子学与固体电子学]