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作 者:童志深[1] 周馥[1] 吴美珍[1] 浦天舒[1] 刘惠珍[1]
出 处:《高分子材料科学与工程》1994年第5期55-59,共5页Polymer Materials Science & Engineering
摘 要:以苯胺为单体在等离子体条件下进行聚合,测量所合成的有机膜经100keV、5×1015cm ̄(-2)Ar ̄+注入后电阻率的变化,并用FTIR、XPS和核分析方法对离子注入引起的结构和成分改变进行了探讨。结果表明,在等离子体环境下,聚合膜内仍含有大量环结构。由于Ar ̄+的注入,聚合膜表面损伤而碳化,使注入层内的体电阻率降低11个数量级。The plasma polymerized organic films starting from aniline were prepared.After implantation of 100 keV,5×1015 cm-2 Ar+ ions,we measured the change of resistivity.The structure modifications induced by ions bomberdment were also investigated with FTIR,XPS and nuclear analysis method.Results showed that ring structures are largely survived in the plasma polymerized organic films under our experimental condition.After Ar+ implantation,the film is carbonized due to degradation.The conductive carbon-rich phases are then created in the implanted layer,it induced the drop of electrical resistivity in implanted layer by the orders of magnitude of 11.
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