装配结构模态仿真与实验对比研究  

RESEARCH ON MODAL ANALYSIS OF ASSEMBLY STRUCTURES BASED ON MSC/NASTRAN

作　　者：赵猛[1] 张以都[1] 马良文[1] 赵丽丽[1] 

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100083

出　　处：《振动与冲击》2005年第1期28-29,93,共3页Journal of Vibration and Shock

摘　　要：在装配结构接合面处添加附加面,利用多点约束(MPC)技术,将装配结构连接在一起,通过合理定义附 加面的材料属性来达到模拟装配零件之间实际连接刚度的目的。在MSC/Nastran平台上,对一种典型的、经过附加面处 理的装配结构进行了模态分析,并与刚性连接、一体化结构的模态分析结果以及模态实验检测结果进行了比较,得出了 十分有益的结论,对实现复杂装配结构的模态分析具有重要参考意义。By attaching an auxiliary surface between the assembled parts, defining the material properties of the auxiliary surface and connecting the assembled parts with the Multi-Point Constraints (MPC) technique, the practical connecting stiffness of the assembly structure can be simulated. Based on the platform of MSC/Nastran, the modal analysis of a typical assembly structure with the auxiliary surface is carried out. The modal analysis results of the assembly structure are compared with those of a corresponding rigid and integrative structure. It is proved to be benefical to use the method of auxiliary surface in modal analysis of complex assembly structures.

关 键 词：装配结构 刚性连接 模态实验 刚度 模态分析 平台 复杂 实验对比 检测结果 接合面 

分 类 号：TU758.15[建筑科学—建筑技术科学] R446.112[医药卫生—诊断学]