碱性无氰镀铜工艺研究  

Alkaline Cyanide-Free Copper Electroplating Technology

作　　者：高琛[1] 尹国光[1] 张自广[1] 吴文锟[1] 潘君[1] 戴美玉[1] 

机构地区：[1]泉州师范学院化学系,福建泉州362000

出　　处：《福建化工》2005年第1期17-20,共4页

摘　　要：研究了碱性无氰镀铜工艺,用贴滤纸法测试了镀层的耐蚀性能;用热震试验和弯曲试验测试了镀层的结合力;用角形阴极试验了镀液的深镀能力。确定了碱性无氰镀铜配方、电流密度、pH值、温度等工艺条件。并用电镀镍的方法测试了铜镀层与其他镀层的结合力。结果表明:该工艺能获得综合性能较好的铜镀层,可取代常规氰化预镀铜工艺。A new process for alkaline cyanide-free copper plating was investigated. The corrosion resistance of the copper coating were tested by the ferroxyl test paper method. The adhesion of the coating were tested by the heating tese and the winding test. The covering power of the plating solution were tested by the angel cathode .The adhesion of the nicked coating on the copper coating were tested. too. The prescription, pH value, temperature and current density of the process were identified. The test show that it is possible to substitute the process for conventional cyanide copper pre-plating.

关 键 词：无氰镀铜 铜镀层 深镀能力 结合力 并用 碱性 镀液 热震试验 耐蚀性能 预镀铜 

分 类 号：TQ153.1[化学工程—电化学工业]