硬磁盘基片研磨的运动分析  

Analysis on the Kinematices of the Lapping of Hard Magnetic Disk Substrate

作　　者：冯连东[1] 吕玉山[1] 哈兰涛[2] 

机构地区：[1]沈阳理工大学机械工程学院,辽宁沈阳110168 [2]上海工程技术大学

出　　处：《沈阳工业学院学报》2004年第4期14-18,共5页Journal of Shenyang Institute of Technology

摘　　要：分析了在硬磁盘基片研磨过程中的运动状况.建立了行星式研磨机的运动学模型.基于这个模型利用蒙特卡罗法分别对磨料切削轨迹、切痕方向的变化、基片表面的瞬态速度场和平均相对速度场等进行了数值模拟,并根据模拟结果研究讨论了在研磨中运动参量对基片表面的材料去除率(MRR)的分布均匀性、表面纹理和其它的质量因素等的影响规律.The kinematics of the lapping of hard magnetic disk substrate is analysed.A kinematic model of the planet lapping machine is developed.On the basis of the model the track of abrasive grains, the change of the direction of the velocity , the field of the transient relative velocity and average relative velocity on the surface of the substrate are numerically simulated respectively by the method of Monte Carlo . According to the results of the simulation, the effects of the kinematics during the lapping on the non-uniformity of material remove rate(MRR) across the surface of the substrate,the texture of the surface and other factors about quality are discussed and researched.

关 键 词：硬盘 基片 运动分析 去除率 磁头 计算机设备 

分 类 号：TP333.3[自动化与计算机技术—计算机系统结构]