Sn-Ag合金系电镀液和电镀工艺  

Sn - Ag Alloy Series Electroplating Solution and Electroplating Process

作　　者：蔡积庆[1] 

机构地区：[1]南京无线电八厂

出　　处：《航空制造技术》2005年第3期106-108,共3页Aeronautical Manufacturing Technology

摘　　要：叙述了由Sn2+化合物、Ag+化合物、螯合剂和添加剂等组成的Sn-Ag合金系电镀液,该镀液具有优良的稳定性,适用于电子部件的可焊性表面精饰。The Sn - Ag alloy series electroplating solution containing Sn2+ compound, Ag+ compound, chelating agent and additive etc. is discussed. The electroplating solution has excellent stability and is suitable for solderability surface finish of electronic parts.

关 键 词：电镀液 电镀工艺 AG^+ 表面精饰 合金 可焊性 组成 化合物 

分 类 号：TG174[金属学及工艺—金属表面处理]