高含水率单板胶接工艺的研究  

Study on the Bonding Process of Veneer with High Moisture Content

作　　者：黄元波[1] 顾继友[1] 李海英[1] 

机构地区：[1]东北林业大学,硕士哈尔滨150040

出　　处：《林产工业》2005年第2期11-14,共4页China Forest Products Industry

摘　　要：研究了单组分湿固化异氰酸酯胶粘剂胶接高含水率单板的工艺条件,详细讨论了含水率、涂胶量、加压压力、加 压时间和养生时间对胶合性能的影响。结果表明:单板含水率、涂胶量是重要的影响因子,单组分湿固化异氰酸酯胶粘 剂可胶接含水率高达100％的单板,在保证胶接强度的前提下,涂胶量仅为传统胶粘剂的1／2-1／3。The processing factors of bonding high moisture content (MC) veneer with one-component moisture curing isocyanate adhesive were studied. The effect of MC, adhesive spread, press parameters and preserving time on the bond characteristic was carefully explored. It showed that the MC of veneer and adhesive spread were the remarkable factors, and the veneer with high MC,even up to 100% , could be successfully glued with one-component moisture curing isocyanate adhesive. To get the same bonding strength, the isocyanate adhesive spread needed was just as much as 1/2 to 1/3 of traditional adhesive.

关 键 词：单组分湿固化异氰酸酯胶粘剂 刨切薄木 含水率 涂胶量 胶接性能 

分 类 号：TS653.2[轻工技术与工程]