脉冲激光微加工技术在MEMS中的应用  

Applications of Pulsed Laser Microfabrication Technology in MEMS

作　　者：李艳宁[1] 唐洁[1] 胡小唐[1] 张国雄[1] 

机构地区：[1]天津大学精密测试技术及仪器国家重点实验室,天津300072

出　　处：《压电与声光》2005年第2期185-189,共5页Piezoelectrics & Acoustooptics

基　　金：国家高技术研究发展专项基金资助项目(2002AA4040907);教育部留学回国人员科研启动基金资助项目(F204008)

摘　　要：介绍了脉冲激光微加工技术及其在微机电系统(MEMS)加工中的应用。脉冲激光微加工技术能够制作出三维微型结构并具有微米/亚微米加工精度,且适用于多种材料,与传统的微细加工技术(光刻、刻蚀、体硅和面硅加工技术等)相比具有其独到之处。阐述了基于激光烧蚀的脉冲激光直接微加工技术、激光-LIGA技术、激光辅助沉积与刻蚀技术以及MEMS的激光辅助操控及装配技术。The paper introduces pulsed laser micromachining and its application in microelectromechanical systems (MEMS). The ability to produce three-dimensional structures with tolerances at the micron or sub-micron level, and to process a wide range of materials, give pulsed laser micromachining some key advantages over other more established micromachining such as photoetching, etching, bulk micromachining and surface micromachining. This paper includes the following topics: pulsed laser direct micromachining based on laser ablation, laser-LIGA process, laser-assisted deposition and etching, laser-assisted manipulation and assembly.

关 键 词：脉冲激光 微机电系统 激光烧蚀 激光-LIGA技术 

分 类 号：TN2[电子电信—物理电子学]