集成铜电极的聚甲基丙烯酸甲脂电泳芯片的制作  

Fabrication of Polymethyl Methacrylate Electrophoresis Chipswith Integrated Copper Electrodes

作　　者：刘军山[1] 罗怡[1] 杜艳[2] 刘冲[1] 王立鼎[1] 周伟红[3] 杨秀荣[2] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]中国科学院长春应用化学研究所电分析化学国家重点实验室,长春130022 [3]吉林大学南岭校区化学学院,长春130022

出　　处：《分析化学》2005年第4期584-587,共4页Chinese Journal of Analytical Chemistry

基　　金：国家高技术研究发展计划(No. 2002AA404460);国家自然科学基金 (No. 50135040; 20299030 );中国科学院长春应用化学研究所电分析化学国家重点实验室基金资助项目

摘　　要：在聚甲基丙烯酸甲脂(PMMA)上溅射金属Cu,然后利用光刻、湿法腐蚀的办法制出铜电极。与另一片含有微沟道的PMMA基片热键合,制成集成铜电极的电泳芯片。在电极制作过程中,对Cu表面上覆盖的正性光刻胶的前、后烘烤温度及时间进行了研究。对Cu腐蚀液的选择及其浓度的确定进行了分析。首次提出采用二次曝光的办法去除铜电极表面的光刻胶。为了证明该种方法的可行性,在制作的一种集成铜电极的PMMA芯片上,进行了循环伏安及动态伏安实验,采用安培法对葡萄糖溶液的电泳分析进行检测。Cu was sputtered onto polymethyl methacrylate (PMMA), and copper electrodes were formed by photolithograph and wet etching; an electrophoresis chip was fabricated by thermally bonding the PMMA with copper electrodes to a PMMA substrate with microchannels. During the course of making electrodes, the temperature and time for pre-bake and hard-bake of positive photoresist on the surface of Cu were studied; the eroding solution of Cu was chosen and its concentration was analyzed; a twice-exposure method was first. put forward to remove the photoresist on copper electrodes. In order to demonstrate the feasibility of this method, cyclic and hydrodynamic voltammetry experiments were performed on a PMMA chip with copper electrodes fabricated by this method, and the electrophoresis of a glucose solution was preformed, and detected by amperometric detection.

关 键 词：聚甲基丙烯酸甲脂 电泳芯片 铜电极 集成 PMMA 正性光刻胶 葡萄糖溶液 湿法腐蚀 制作过程 烘烤温度 电极表面 二次曝光 循环伏安 电泳分析 Cu 热键合 微沟道 腐蚀液 安培法 溅射 基片 

分 类 号：O657.1[理学—分析化学]