新型低黏度苯并口恶嗪树脂  

A NOVEL LOW VISCOSITY BENZOXAZINE RESIN

作　　者：向海[1] 凌鸿[1] 王劲[1] 宋霖[1] 顾宜[1] 

机构地区：[1]高分子材料工程国家重点实验室四川大学高分子科学与工程学院,四川成都610065

出　　处：《热固性树脂》2005年第2期10-12,21,共4页Thermosetting Resin

摘　　要：介绍了1种新型低黏度苯并口恶嗪树脂,用旋转黏度计研究了这种树脂的黏度,用DSC和凝胶化时间测试等研究了其固化反应行为,并对树脂浇注体和复合材料进行了力学性能测试。实验结果表明,这种树脂具有良好的工艺性能和较高的力学性能,可作为树脂传递模塑成型RTM的高性能复合材料基体树脂或高性能封装用树脂。In this paper,a novel low viscosity benzoxazine resin,which made from aromatic diamine,phenol and formaldehyde,was reported.The viscosity of the resin was investigated with rotary viscometer,the curing behaviors of the resin were studied with DSC and gel-time measurement,and the mechanical properties of the cured neat resin and glass fiber reinforced composite were investigated.The resin had better process properties,higher mechanical properties,and could be used as a RTM matrix resin for high performance composites or as a high performance electronic packaging resin.

关 键 词：低黏度树脂 苯并噁嗪 聚合物树脂基体 

分 类 号：TQ323.1[化学工程—合成树脂塑料工业]