大功率白光LED封装技术的研究  

Packaging Technique of High-power White LED

作　　者：钱可元[1] 胡飞[1] 吴慧颖[1] 罗毅[1] 

机构地区：[1]清华大学深圳研究生院,广东深圳518057

出　　处：《半导体光电》2005年第2期118-120,共3页Semiconductor Optoelectronics

摘　　要：详细分析了照明用大功率LED的封装技术,在大量实验的基础上,提出了一些具体的解决方案,设计了独特的封装结构。介绍了在色度稳定性与均匀性、改善散热条件等方面所作的探索,并对LED驱动电流和发光色温的关系进行了讨论。Packaging techniques of the white power LEDs for lighting have been analyzed in detail. On the basis of a great deal of experiments, several practical methods are introduced, and a unique package structure has been designed to meet the needs for the GaN blue LED chips. Some explorations are introduced about keeping the stability and uniformity of whiter LED's chroma and thermal treatment of power LED. The relationships between driving current and correlative color temperature for white LED have been discussed.

关 键 词：半导体照明 大功率LED 封装 

分 类 号：TN312.8[电子电信—物理电子学]