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出 处:《焊接学报》2005年第4期5-8,共4页Transactions of The China Welding Institution
基 金:国家自然科学基金重大资助项目(50390064);国家重点基础研究发展计划项目(2003CB716202)
摘 要:设计了一系列的粗铝线楔焊键合试验,用扫描电镜测试分离的楔焊界面,通过采集驱动电信号分析了压电陶瓷输入功率特性。结果表明,Ni-Al超声键合的界面模式形如脊皱圆环,中心和外边是未结合的摩擦痕,脊皱构成强度,相同参数条件下,一焊脊皱峰和转化的超声能大于二焊;其它参数不变的条件下,随压力的增加,键合面尺寸增大,圆环的短轴延伸为长轴,随时间的增加,脊皱扩展为完整的圆环,脊皱尺寸向中央扩大,随功率的增加,摩擦痕和脊皱加剧,且这些参数存在一个最佳范围。A series of experiments was carried out on structure characteristics and evolution at the bond interface. Bond lift-off characteristics were studied by using scanning electron microscope with energy dispersive spectroscope. Power characteristics of piezoelectric transducer were analyzed by the driving electric signal measured. Results show that the pattern of partially bonded material at the Ni-Al interface of ultrasonic wedge bonds exposed by peeling underdeveloped bonds simulates a ridged torus with an unbonded central and external region rubbed along pulse direction. Bonding strength is located between the severely ridged torus and the non-adhering central and external area of the bond. For the same variables, ridge-peak and transforming ultrasonic energy of first wedge bonding are greater than that of second wedge bonding. For other variables constant, with increasing load, the total area of bond pattern increases in size, and minor axis of torus extends major axis; with increasing time, the ridged periphery spreads a whole torus, and the ridged location of the bonded region moves closer to the bond center; the sliding trace and the ridge-like of the bond pattern strengthen when more power applied.
分 类 号:TN45[电子电信—微电子学与固体电子学]
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