Sn-Ce-Me无铅钎料合金活度相互作用系数的计算及应用  

Calculation and application for activity interaction parameters of Sn-Ce-Me lead-free solder slloys

作　　者：薛松柏[1] 陈燕[2] 吕晓春[2] 

机构地区：[1]南京航空航天大学,南京210016 [2]哈尔滨焊接研究所,哈尔滨150080

出　　处：《焊接学报》2005年第4期45-47,80,共4页Transactions of The China Welding Institution

摘　　要：采用周模型计算分析了Sn-Ce-Me(Me=Pb、Bi、Zn、Sb、Ag、Cu、Cd)三元合金系中,Ce与Sn以及Ce与Me之间的活度相互作用系数。计算结果表明,不仅在Sn-Pb-Ce中,Ce存在“亲Sn”现象,在其它6个三元无铅钎料合金体系中,如Sn-Bi-Ce、Sn-Sb-Ce、Sn-Zn-Ce、Sn-Cd-Ce、Sn-Ag-Ce、Sn-Cu-Ce,Ce也同样存在着“亲Sn”现象。其研究结果可为新型无铅钎料的研究提供理论分析依据。The activity interaction parameters between Ce and Sn or Me in Sn-Ce-Me ternary alloy systems(Me=Pb,Bi,Zn,Sb,Ag,Cu,Cd)are calculated and analyzed by means of Chou model. The calculating results show that Ce have high affinity with element Sn not only in Sn-Pb-Ce ternary alloy system, but also in Sn-Bi-Ce,Sn-Sb-Ce,Sn-Zn-Ce,Sn-Cd-Ce,Sn-Ag-Ce,Sn-Cu-Ce ternary alloy system. The results will provide foundations for theoretical analysis for developing new lead-free solder alloys.

关 键 词：铈 无铅钎料 周模型 活度相互作用系数 

分 类 号：TG454[金属学及工艺—焊接]