玻璃基板激光微细熔覆柔性布线技术研究  

Study of Conductor Fabrication by Laser Micro-Cladding Electronic Pastes on Glass Substrate

作　　者：李祥友[1] 祁小敬[1] 曾晓雁[1] 

机构地区：[1]华中科技大学激光技术国家重点实验室,湖北武汉430074

出　　处：《中国激光》2005年第5期713-716,共4页Chinese Journal of Lasers

基　　金：国家自然科学基金(50075030);国家863计划(2001AA421290)资助项目。

摘　　要：与传统的布线技术相比,激光微细熔覆柔性布线技术可以提高线路板制备的效率并降低生产成本。对基于玻璃基板的激光微细熔覆柔性布线技术的工艺进行了重点研究,分析了激光功率密度和扫描速度对导体厚度和宽度的影响规律,同时研究了烧结时间对导体电阻率和结合强度的影响趋势。试验表明,激光功率密度和扫描速度对导线的厚度影响不大,而对导线的宽度有着重要的影响。导线宽度随功率密度增加、扫描速度减小而增加,并都存在临界值;随着烧结时间延长,导线电阻率减小,结合强度提高。在此基础上,探讨了导体附着机理和导电机理。Compared with traditional methods, conductor fabrication technology by laser micro cladding electronic pastes (LMCEP) can improve the efficiency and lower the production cost. In this paper, processes of silver conductor fabrication were studied. The effect of laser power density and scanning speed on conductor thickness and linewidth was researched systematically, at the same time, the effect of firing time on resistivity and adhesion strength was also analyzed. The result showed that, they which had critical values had very little effect on thickness of conductor and played a very important role on its linewidth, and with increasing the power density and decreasing the scanning speed, the linewidth increased. Besides, with the delaying of sintering time, the resistivity decreased and adhesion strength enhanced, on base of which the conductive and adhesive mechanisms were explored too.

关 键 词：激光技术 激光微细熔覆柔性布线 玻璃基板 银导体 

分 类 号：TN249[电子电信—物理电子学]