微硅加速度计中静电键合封接技术的应用  

Application of Anodic Bonding to Micro-Si Accelerometer

作　　者：邓宏论 

机构地区：[1]航天科技集团时代电子公司第十六研究所,陕西西安710100

出　　处：《电子机械工程》2005年第3期40-41,共2页Electro-Mechanical Engineering

摘　　要：在微硅加速度计的研制中,静电键合具有传统胶接技术所无法比拟的优点,是目前该加速度计研制中广泛应用的粘接技术。叙述了静电键合技术的机理和它在微硅加速度计装配中的具体工艺流程,指明了技术的关键之处,并分析了该技术的优缺点,提出了进一步改进的方案。In the development of micro-Si accelerometer, anodic bonding has an advantage that traditional gluing technique can′t match, so it is now widely used in adhesion of the accelerometer. In this article, the principle of anodic bonding technique and technology flow in assembling of micro-Si accelerometer are described , the key moment is pointed out, the advantage and disadvantage of the technique are also analyzed, and a modification scheme is put forward.

关 键 词：静电键合 化学键 微硅加速度计 

分 类 号：TN305.94[电子电信—物理电子学]