FePt/Cu多层膜化降低L1_0-FePt有序化温度  

LOWERING OF ORDERING TEMPERATURE FOR L1_0-FePt IN FePt/Cu MULTILAYERS

作　　者：李宝河[1] 黄阀[1] 杨涛[1] 冯春[1] 滕蛟[1] 朱逢吾[1] 

机构地区：[1]北京科技大学材料物理与化学系

出　　处：《金属学报》2005年第6期659-662,共4页Acta Metallurgica Sinica

基　　金：国家自然科学基金50301002北京市科技新星计划H0213821290120资助项目

摘　　要：采用直流磁控溅射方法制备FePt/Cu多层膜,再经不同温度下真空热处理得到有序L10-(FePt)100-xCux薄膜.结果表明,Cu的添加可以降低FePt薄膜有序化温度.[FePt(4nm)/Cu(0.2nm)]10多层膜在350℃热处理1h后,有序度增至0.6,矫顽力达到421kA/m.对插入极薄Cu层促进有序化在较低的温度下进行的热力学和动力学因素进行了讨论.FePt/Cu multilayers and FePt thin films were prepared by DC magnetron sputtering. The as-prepared samples were annealed in vacuum at a temperature range of 300-550 degrees C for 1 h. It is found that the addition of Cu could reduce the ordering temperature of FePt. The ordering parameter S was evaluated to be 0.6, and the coercivity reached 421 kA/m in [FePt(4 nm)/Cu(0.2 nm)](10) multilayers annealed at 350 degrees C. The Cu layer induced reduction of ordering temperature is ascribed to both kinetic and thermodynamic factors.

关 键 词：FePt/Cu多层膜 L10-FePt有序相 磁控溅射 有序度 

分 类 号：TG111[金属学及工艺—物理冶金] O614[金属学及工艺—金属学]