陶瓷表面无敏化活化法微细化学镀铜  

Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation

作　　者：续振林[1] 郭琦龙[1] 沈艺程[1] 赵雄超[1] 洪艳萍[1] 辜志俊[1] 

机构地区：[1]中科院福建物质结构研究所二部

出　　处：《电化学》2005年第2期193-198,共6页Journal of Electrochemistry

基　　金：厦门市科技创新基金(3502Z2000401)资助

摘　　要：本文提出一种新的化学镀铜工艺,与激光微细刻蚀技术相结合可在Al2O3基底上实现无敏化活化化学镀铜,获得光亮致密、分辨率较高(40μm),导电性良好的化学镀层.The purpose of this article is to provide a new technology of electroless copper plating without palladium activation steps. By combining the technology of laser micro-etching with the new copper-plating bath, copper plating on ceramics was obtained. The experimental results showed that the solution used for copper electroless plating was stable and the copper coating obtained was bright,dense with good electrical conductivity.The line definition was about 40 μm. The electroless Cu films deposited from this system were gentle and required simple operating conditions.

关 键 词：陶瓷基底 化学镀铜 活化 络合剂 金属化 互连导线 

分 类 号：TQ153.14[化学工程—电化学工业]