无钯催化纳米炭纤维化学镀铜的研究  

Research of Chemical Cu-plating on the CNF Absent of Palladium

作　　者：高丽新[1] 李红霞[1] 高妍[1] 程陆凡[2] 李洪锡[2] 

机构地区：[1]鞍山科技大学,114044 [2]中科院沈阳金属所,110016

出　　处：《新技术新工艺》2005年第6期66-68,共3页New Technology & New Process

基　　金：国家863项目(2002AA327110)

摘　　要：研究了不用贵重金属钯催化,直接在纳米炭纤维上化学镀铜的新方法。实验分析并探讨了还原剂浓度、镀液温度、pH值、配位体种类、镀覆时间、引发剂、稳定剂等因素对纳米炭纤维化学镀铜效果的影响,确定了较佳工艺条件;采用SEM观察镀层形貌,EDX表征镀层。实验结果表明以Cu2+为单质铜来源,甲醛为还原剂,在合适的镀液配方中加入引发剂T,在优化的工艺条件下,可将铜直接镀覆在硝酸处理后的纳米炭纤维上。The paper introduces the new technique of electroless copper deposition on the carbon nanofibers directly under absence of palladium as catalyzer. The effects of experimental parameters such as concentration of reducer, temperature of plating-liquid, hydrogen ion concentration, kinds of ligand, time, initiator, stabilizer were studied and the optimum processing conditions were determined.The conformation of cladding was detected and proofed by SEM and EDX. The results of experiment show that copper can deposit on the carbon nanofiber treated by nitric acid when Cu 2+ is used as the origin of copper and formaldehyde as reducer by adding initiator T into the appropriate composition of plating-liquid.

关 键 词：纳米炭纤维 化学镀铜 钯催化 工艺条件 SEM观察 Cu^2+ 贵重金属 实验分析 镀液温度 镀层形貌 镀液配方 硝酸处理 还原剂 引发剂 pH值 配位体 稳定剂 EDX 镀覆 甲醛 

分 类 号：TQ342.742[化学工程—化纤工业] TQ153.14