低温共烧片式多层带通滤波器仿真优化及制备  

Simulation Optimizing and Preparation of LTCC Multilayer Bandpass Filter

作　　者：邹佳丽[1] 张启龙[1] 杨辉[1] 陆德龙 

机构地区：[1]浙江大学材料与化工学院,浙江杭州310027 [2]浙江正原电气股份有限公司,浙江嘉兴310043

出　　处：《电子元件与材料》2005年第7期29-31,34,共4页Electronic Components And Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2003AA302760);浙江省重大科技项关资助项目(0221101562)

摘　　要：采用AnsoftHFSS电磁场模拟仿真软件,对LTCC多层带通滤波器制备过程中的介质材料与工艺偏差进行模拟仿真,并与实际器件测试结果对比。研制的片式多层带通滤波器的偏差的允许范围是:微波介质陶瓷材料介电常数误差±2%,而品质因数由于本身较高,在一定范围内对滤波器的性能影响不大;工艺上应控制流延生瓷片厚度±1.5μm、叠层/切割误差±50μm,工艺中的分层缺陷则导致器件性能劣化,中心频率严重偏移。The Ansoft HFSS (High Frequency Structure Simulator, HFSS for short) software was used to analyze the dielectric material and process tolerance in the preparation of LTCC multilayer bandpass filters. The analysis results were compared to the measurement results. Based on the filters prepared, the ceramic microwave dielectric constant (εr) tolerance is ±2%, Q value of ceramic is not of vital importance to the characteristics of the bandpass filters , especially on the condition that the ceramic have a high Q value; in process, the thickness tolerance of green sheet is ±1.5 μm, the lamination or cutting tolerance is ±50 μm, and filter’s center frequency is deviated a lot due to the delamination.

关 键 词：电子技术 LTCC 多层带通滤波器 工艺 

分 类 号：TN713.3[电子电信—电路与系统]