利用金属间化合物增强陶瓷钎焊接头——接头组织与界面反应  

Reinforcement of Ceramic Bonded Joints with Intermetallic Compounds——Microstructures and Interfacial Reaction of Joints

作　　者：张德库[1] 邹贵生[1] 吴爱萍[1] 刘根茂[1] 

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《材料工程》2005年第5期15-18,共4页Journal of Materials Engineering

基　　金：国家自然科学基金资助项目(50075046)

摘　　要：为了提高Si3N4陶瓷连接接头高温性能及减小接头因热膨胀系数不匹配而产生的应力,采用Ag Cu Ti钎料和NiTi复合中间层进行半固态连接。接头组织观察表明,钎缝主要由NiTi(Cu)金属间化合物和Ag Cu基体组成。研究表明,Ni与Ti的加入量对于钎缝中金属间化合物的形态及钎缝与母材界面反应层的形成具有十分重要的影响。Si3N4 ceramics were bonded with Ag-Cu-Ti, in which Ti/Ni/Ti multi-interlayer was added in order to improve high temperature properties of the joints and decrease the residual stress. The results show that the joint comprises Ag-Cu matrix and intermetallic compounds with Ni, Ti, and Cu. The amount of Ni and Ti addition into weld has an important effect on status of intermetallic compounds and formation of interfacial reaction layer between weld and substrate.

关 键 词：SI3N4 原位 金属间化合物 钎焊 界面反应层 

分 类 号：TG454[金属学及工艺—焊接]