半导体制造中清洗技术的新动向  

The Present Trend of Cleaning Technology in Semiconductor Manufacturing

作　　者：许宝兴[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030027

出　　处：《电子工业专用设备》2005年第7期1-6,10,共7页Equipment for Electronic Products Manufacturing

摘　　要：多年来习惯采用多槽浸渍式RCA清洗的半导体清洗领域里,正在兴起的是从多槽浸渍式向单片式处理转移。并出现了取代RCA法的新型清洗液与新的生产方法。正在开始对超临界流体清洗等下一代清洗技术的开发。概述这些半导体清洗技术的最新动向。Multi-tank immersion cleaning has been used in semiconductor cleaning for many years. Now single wafer process will spring up. New cleaning liquid and production method has come up, and in place of RCA. The next cleaning technology of super critical fluid cleaning is under development. This article summrizes the new trends of semi conductor cleaning.

关 键 词：半导簿制造 清汔技术 墨圆 

分 类 号：TN305.97[电子电信—物理电子学]