非致冷红外焦平面阵列读出电路的设计和SPICE模拟  

Design and SPICE Simulation of CMOS Readout Integrated Circuits of Uncooled IRFPA

作　　者：李祥辉[1] 陈西曲[1] 王双保[1] 易新建[1] 

机构地区：[1]华中科技大学光电子工程系,湖北武汉430074

出　　处：《红外技术》2005年第4期307-310,共4页Infrared Technology

摘　　要：读出电路是非致冷红外焦平面阵列的核心部件之一,对电路进行SPICE模拟是验证电路的重要手段。针对近年来得到迅猛发展的微测辐射热计(VOx)非致冷红外焦平面阵列的特点,提出了相应CMOS读出电路的设计方案,并用PSpice9.2给出了4×4CMOS读出电路的实现和精确的模拟结果。模拟结果表明,该方案是适合微测辐射热计非致冷红外焦平面阵列读出电路一种较为理想的形式,同样也适合于大阵列(如160×120和320×240)的CMOS读出电路。Readout integrated circuits (ROIC) is one of the core components of uncooled infrared focal plane arrays (Uncooled IRFPA). SPICE simulation on the circuit is an important method that verifies ROIC. According to the features of Uncooled microbolometer(VOx) IRFPA which has developed very rapidly in recent years, the design scheme of corresponding CMOS ROIC is presented. ROIC with an array of 4×4 has been designed and the accurate simulation results are given on PSpice 9.2 and show it is a good choice for CMOS ROIC of Uncooled microbolometer IRFPA and applied to CMOS ROIC with a larger array such as 160×120 and 320×240.

关 键 词：读出电路 模拟 SPICE 微测辐射热计 氧化钒 非致冷红外焦平面阵列 

分 类 号：TN215[电子电信—物理电子学]