锡-银系无铅焊料动态强度研究  

Dynamic Strength of Pb-free Sn-Ag Based Solders

作　　者：支建庄[1] 郑坚[1] 赵庆岚[1] 姚战军[1] 

机构地区：[1]军械工程学院,河北石家庄050003

出　　处：《兵器材料科学与工程》2005年第4期27-30,共4页Ordnance Material Science and Engineering

摘　　要：利用分离式霍普金森压杆试验技术,在室温下研究了锡-银系无铅焊料在高应变率条件下的动态压缩力学性能。结果表明,锡-银系无铅焊料有显著的应变率效应:随着应变率的增加,材料的屈服强度和流动应力有显著的提高;在对数坐标系下其动态屈服强度随应变率呈线性变化,证明锡-银系焊料是一种很有希望替代锡铅焊料的无铅焊料。最后根据Malvern过应力理论建立了锡-银系无铅焊料的动态本构关系。The dynamic compressive properties of Sn-Ag Pb-free solders have been studied by means of a split Hopkinson pressure bar at high strain rates. Tests were conducted at room temperature and under uniaxial compressive conditions. The dynamic mechanical properties and the effect of strain-rate on lead-free solder are discussed. And it is found that the dynamic yield stress of the solders largely falls into a linear relation to the strain rate in logarithm scales. Phenomenological constitutive relations were then established following Malvern theory.

关 键 词：无铅焊料 分离式霍普金森压杆 动态强度 动态本构关系 

分 类 号：TG146[一般工业技术—材料科学与工程] O348[金属学及工艺—金属材料]